1. BGA (Ball Grid Array) A type of substrate where solder balls are used to mount on the surface. It connects the PCB and the main board (motherboard) using solder balls and the chip and PCB are connected using wire bonding. Depending on the material used, there are variations like PBGA (Plastic), CBGA (Ceramic), TBGA (Tape), and Metal (Lead Frame) PGB. 2. FCBGA (Flip Chip Ball Grid Array) FCBGA..

There are various types of substrates used in semiconductor manufacturing. Today, let's explore different types of substrates. 1. CSP (Chip Scale Package) CSP is utilized in mobile electronic devices. Its small size leads to improved design density, and it boasts a high I/O count per unit area. CSP achieves high density by stacking chips. The chip occupies over 80% of the total package area. 2. ..