I will learn about the mechanism and additives of electroless copper plating. Electroless Copper Plating Mechanism: Applying a cathode to the product intended for plating, causing the deposition of Cu. Soluble anode vs Insoluble anode 비교 Soluble anode - reaction : Cu -> Cu2+ + 2e- - by product : need to management with lever less donate system - cost : cheap - current distribution : poor - anode..

Today, we will delve into the electroplating process as part of the substrate plating stages. Electroplating involves using electro-deposition to grow a thin copper (Cu) layer on top of the chemically deposited layer. This process enhances reliability. Electroplating Process Overview: It involves introducing a plating solution containing Cu ions and supplying electrons to the plating solution to..