Package, wire bonding, flip chip
In the previous session, we learned about various types of substrates. In this session, we will start by exploring substrate terminology and then delve into SiP (System in Package) substrates in detail. PKG (Package) PKG is a technology that electrically connects semiconductor chips (Die) to a substrate and protects circuits from external impact. It is categorized based on the number of chips an..
2023.09.11