Continuing from the previous session, let's delve into troubleshooting electroless defects and their causes. Dimple Defect: Low copper concentration -> Add cuprous oxide or high-purity cupric sulfate. High sulfuric acid concentration -> Partial descaling. When the copper concentration is low or sulfuric acid concentration is high, deposition occurs in a hole-like manner due to increased polariza..

Major Components of Electroless Plating - Inorganic CuSO4*5H2O: Source of Cu ions, increases conductivity of the plating solution along with sulfuric acid. H2SO4: Improves electrical conductivity, enhances throwing power, and reduces plating thickness variations. Cl-: Assists in inhibiting plating reduction along with the carrier. Aids in the reduction reaction from Cu2+ to Cu+ along with the br..

Electroplating Equipment Structure: Loader - Degreasing - Rinse - Trevisash - Rinse - Sulfuric Acid Bath - Anode Copper Bath - Rinse - Trevisash - Rinse - Unloader Components include the cathode, bus bar (+), anode bus bar, insoluble anode (-), membrane filter, hanger (clamp), working panel, e-ductors, and panel guide. Electroplating Detailed Process Pretreatment - Electroplating Pretreatment: I..