Types of Substrates (BGA, FCBGA, SiP)

1. BGA (Ball Grid Array) A type of substrate where solder balls are used to mount on the surface. It connects the PCB and the main board (motherboard) using solder balls and the chip and PCB are connected using wire bonding. Depending on the material used, there are variations like PBGA (Plastic), CBGA (Ceramic), TBGA (Tape), and Metal (Lead Frame) PGB. 2. FCBGA (Flip Chip Ball Grid Array) FCBGA..

2023.09.07