Step(2)
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Drilling process (6)
CO2 Laser Process A processing step within the package substrate process for implementing via holes. The layer-to-layer connection via holes are formed by controlling the beam power of the laser equipment. CO2 Laser Equipment Setup CO2 Laser equipment is divided into an oscillator, optical path, and processing unit. Galvano Mirror Configuration Galvano consists of mirrors and F-theta lenses. Gal..
2023.10.19 -
Substrates Cross Section (2)
4. The fully cured mold is now ready for sectioning. In simple terms, this involves using a grinder. There are four steps, from 1 to 4, with each step becoming progressively smoother. Step 1 is the roughest, so it's common to go up to step 1 just before reaching the desired height. For point sections, it's crucial to only section up to the exact point, so care must be taken not to remove the poi..
2023.08.24