Overgrowth Phenomenon: Poor DFR Adhesion -> Review DFR process. Pre-treatment error -> Adjust pre-treatment conditions. If DFR adhesion is poor or pre-treatment is too strong, overgrowth (bulging) of DFR occurs, causing detachment of the plated area. Thick film layer -> Change current settings. If the film layer is too thick, overgrowth beyond the DFR boundary occurs. Poor adjustment of shieldin..

Major Components of Electroless Plating - Inorganic CuSO4*5H2O: Source of Cu ions, increases conductivity of the plating solution along with sulfuric acid. H2SO4: Improves electrical conductivity, enhances throwing power, and reduces plating thickness variations. Cl-: Assists in inhibiting plating reduction along with the carrier. Aids in the reduction reaction from Cu2+ to Cu+ along with the br..

Substrate sectioning can be classified into three types based on the mold type, sectioning purpose, etc. Let's explore this and also look into p-lab as a side note. 1. Point Section A point section involves sectioning only up to a specific point. For example, it's often used to observe defects caused by foreign particles, such as bump defects or pinhole defects, on the substrate. The mold for a ..

4. The fully cured mold is now ready for sectioning. In simple terms, this involves using a grinder. There are four steps, from 1 to 4, with each step becoming progressively smoother. Step 1 is the roughest, so it's common to go up to step 1 just before reaching the desired height. For point sections, it's crucial to only section up to the exact point, so care must be taken not to remove the poi..

Through sectioning, you can observe a cross-section of the substrate. Today, we will delve into the process of sectioning. Process of Sectioning The process of sectioning is as follows: 1. Punch the substrate into small rectangles or squares. As explained later, for point sections, square punching is done, and you must be careful not to cut the point section during punching. 2. Insert the punche..