Plating process (15)
Overfill Defect: High copper concentration -> Dummy plating / Partial descaling. Low sulfuric acid concentration -> Add purified sulfuric acid. High current density -> Reduce current density. Low Brightener concentration -> Increase Brightener concentration. Weak agitation -> Review spray pump settings / Nozzle cleaning, filter replacement. Weak or blocked nozzle and filter inlet weaken agitatio..
2023.12.21