The substrate electroplating process consists of three stages: desmear, chemical electroplating, and electroplating. In this session, we will focus on the first stage, the desmear process. Desmear: The process of removing smear generated during laser processing to clean the holes. Smear is composed of polymer resin residues and carbides formed due to the heat generated during drilling (CNC or La..

Drill Bit Overview The drill bit needs to sequentially machine holes in the stacked board, so it is composed of high-strength materials, mainly tungsten and cobalt. Drill Bit Ring The collar ring that supports the bit to be aligned with the appropriate length in the Drilling M/C and Spindle Chuck is referred to as the drill bit ring. This ring is color-coded for different diameters to allow easy..

Today, we will learn about the substrate drilling process. Drilling Process: This process involves machining PTH (Plating Through Hole) for interlayer circuit connection and NPTH (Non Plating Through Hole) for reference points and fixture assembly on the stacked panels. Purpose: Machining reference points for the product after lamination. Creating holes for interlayer electrical connections. Mac..