Plating process (10)
Major Components of Electroless Plating - Inorganic CuSO4*5H2O: Source of Cu ions, increases conductivity of the plating solution along with sulfuric acid. H2SO4: Improves electrical conductivity, enhances throwing power, and reduces plating thickness variations. Cl-: Assists in inhibiting plating reduction along with the carrier. Aids in the reduction reaction from Cu2+ to Cu+ along with the br..
2023.12.04