Stripping: After electroplating, the photosensitive film DFR is removed using a dedicated stripping agent of Amin-based chemicals for fine circuit formation First, the dry film swells and strips Stripped dry film fragments cannot withstand internal pressure and break apart Residue on the bottom is removed through additional stripping spray process Improper stripping that leaves DFR behind can in..

Next, let's learn about the main mechanisms for each circuit fabrication process. Major Mechanisms for Each Circuit Fabrication Process Front Side - DFR Adhesion (Lamination) - Photolithography - Stripping - Etching - AOI Front Side: Removal of foreign substances from the substrate surface before adhering the photosensitive film DFR (Rinse - Acid Rinse - Rinse) DFR Adhesion (Lamination): Adhesio..

Let's learn about the PCB circuit fabrication process. Types of Circuit Implementation Processes There are two types of circuit implementation processes: Tenting method and SAP method. Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form. The detailed process is as follows: Via hole processing Non-electrolytic ..

Scanning Electron Microscope (SEM) is an electron microscope that uses an electron beam to obtain the surface of a specimen, and it has superior resolution compared to an optical microscope. Today, we will explore the usage of SEM, specifically focusing on the initial procedures. Process before inserting into SEM machine: I take SEM images of molded circuit boards. Since the molding itself is an..

기판 회로 공정에 대해 알아보겠습니다. 회로 구현 프로세스 종류 회로 구현 프로세스의 종류에는 텐팅 공법과 SAP 공법이 있습니다. 텐팅 공법 : 불필요한 구리를 에칭(식각)하여 필요한 디자인의 구리만 남겨 회로를 형성하는 공법 세부 공정은 다음과 같습니다. 1. Via hole 가공 2. 무전해 + 전해 동도금 3. lamination : 감광성 필름 (DFR : Dry Film Registration) 밀착 4. Photo + Develop : 제품 회로 디자인대로 노광을 하고, 불필요한 DRF을 제거(현상) 5. Etching : DRF이 제거되어 노출된 구리를 약품을 이용하여 제거 6. Stripping : 기능을 다한 DFR을 약품을 이용하여 제거 SAP (Semi Additive Process..