Last time, we learned about the purpose and principles of chemical plating, as well as the detailed process up to cleaner/conditioner. In this session, we will continue with the next step in the detailed process, which is soft-etching. Detailed Chemical Plating Process: cleaner/conditioner - soft etching - pre dip - catalyst - reducer - electroless copper Soft Etching: Removes oxide layers on th..

Substrate sectioning can be classified into three types based on the mold type, sectioning purpose, etc. Let's explore this and also look into p-lab as a side note. 1. Point Section A point section involves sectioning only up to a specific point. For example, it's often used to observe defects caused by foreign particles, such as bump defects or pinhole defects, on the substrate. The mold for a ..

Through sectioning, you can observe a cross-section of the substrate. Today, we will delve into the process of sectioning. Process of Sectioning The process of sectioning is as follows: 1. Punch the substrate into small rectangles or squares. As explained later, for point sections, square punching is done, and you must be careful not to cut the point section during punching. 2. Insert the punche..