Electroplating Equipment Structure: Loader - Degreasing - Rinse - Trevisash - Rinse - Sulfuric Acid Bath - Anode Copper Bath - Rinse - Trevisash - Rinse - Unloader Components include the cathode, bus bar (+), anode bus bar, insoluble anode (-), membrane filter, hanger (clamp), working panel, e-ductors, and panel guide. Electroplating Detailed Process Pretreatment - Electroplating Pretreatment: I..

There are various types of substrates used in semiconductor manufacturing. Today, let's explore different types of substrates. 1. CSP (Chip Scale Package) CSP is utilized in mobile electronic devices. Its small size leads to improved design density, and it boasts a high I/O count per unit area. CSP achieves high density by stacking chips. The chip occupies over 80% of the total package area. 2. ..