Catalyst: Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections). Maintains a stable liquid state (should have minimal bubble and impurity generation). Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections. Reducer: Imparts reduction ability to t..

2. Sectioning (Square Punching) Sectioning other than point sectioning involves a waxing-crescent-shaped mold, similar to a half-moon shape. The purpose of general sectioning is to observe a consistent thickness of plated layer. Substrates punched into squares are placed in molds with recesses. When analyzing a large number of substrates, it's common to place 3 to 4 substrates per recess. Howeve..