Catalyst: Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections). Maintains a stable liquid state (should have minimal bubble and impurity generation). Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections. Reducer: Imparts reduction ability to t..

The substrate electroplating process consists of three stages: desmear, chemical electroplating, and electroplating. In this session, we will focus on the first stage, the desmear process. Desmear: The process of removing smear generated during laser processing to clean the holes. Smear is composed of polymer resin residues and carbides formed due to the heat generated during drilling (CNC or La..