Plating process (6)

Catalyst: Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections). Maintains a stable liquid state (should have minimal bubble and impurity generation). Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections. Reducer: Imparts reduction ability to t..

2023.11.20