Catalyst: Pd complexes are adsorbed onto the non-conductive areas of the hole walls (such as epoxy/glass and PI film sections). Maintains a stable liquid state (should have minimal bubble and impurity generation). Important for Pd ion adsorption on the hole interior to ensure uniform plating thickness and achieve coverage on epoxy and glass fiber sections. Reducer: Imparts reduction ability to t..

Last time, we learned about the purpose and principles of chemical plating, as well as the detailed process up to cleaner/conditioner. In this session, we will continue with the next step in the detailed process, which is soft-etching. Detailed Chemical Plating Process: cleaner/conditioner - soft etching - pre dip - catalyst - reducer - electroless copper Soft Etching: Removes oxide layers on th..

Principle of Chemical Plating (However, the specific chemicals used, designs, and principles can vary depending on the chemicals used.) Utilizing the tendency of metals to ionize, Cu ions are reduced and deposited onto the product using Pd as a catalyst. Formaldehyde (HCHO) is oxidized to emit electrons on the Pd surface, supplying Cu+ ions to facilitate the deposition of Cu on the Pd surface. P..