Circuit process (1)

Let's learn about the PCB circuit fabrication process.

 

Types of Circuit Implementation Processes

 

There are two types of circuit implementation processes: Tenting method and SAP method.

 

Tenting Method: A process where unnecessary copper is etched away, leaving only the required copper for the desired circuit design to form.

 

The detailed process is as follows:

 

Via hole processing

Non-electrolytic + Electrolytic plating

Lamination: Adhesion of photosensitive film (DFR: Dry Film Registration)

Photo + Develop: Exposure according to the product circuit design, and removal (development) of unnecessary DFR

Etching: Removal of exposed copper using chemicals after removing DFR

Stripping: Removal of used DFR using chemicals

SAP (Semi Additive Process) Method: A process where copper is selectively grown according to the product circuit design to implement the circuit.

 

The detailed process is as follows:

 

Via hole processing

Non-electrolytic + Flash plating (electrolytic)

Lamination: Adhesion of photosensitive film (DFR: Dry Film Registration)

Photo + Develop

Pattern plating

Stripping

Flash-etching