Plating process (8)

Electroplating Equipment Structure:

Loader - Degreasing - Rinse - Trevisash - Rinse - Sulfuric Acid Bath - Anode Copper Bath - Rinse - Trevisash - Rinse - Unloader

 

Components include the cathode, bus bar (+), anode bus bar, insoluble anode (-), membrane filter, hanger (clamp), working panel, e-ductors, and panel guide.

 

Electroplating Detailed Process

Pretreatment - Electroplating

 

Pretreatment:

It involves removing surface oxidation and organic contaminants to enhance adhesion and growth of the plating layer.

 

Electroplating Bath:

By emitting electrons into a copper sulfate solution, Cu+ ions in the solution are deposited onto the surface of the plating electrode connected to the cathode.

 

Faraday's Law:

Plating Weight [g] = (I * T * M) / (Z * F)

 

I = Current [A]

T = Time [sec]

M = Atomic weight of metal (63.546 [g/mol])

Z = Number of electrons involved in the reduction of metal ions (2)

F = Faraday constant (96485 [C/mol])

 

Plating Thickness [um] = (W * 100) / (S * D)

 

W = Plating weight [g]

S = Plating surface area [dm^2]

D = Density (8.94 [g/cm^3])

 

So far, we have explored the electroplating process and its detailed aspects. In the next post, we will delve into the mechanisms of electroplating, additives, and defects.